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  features  glass passivated die construction  high case dielectric strength of 1500v rms  low reverse leakage current  surge overload rating to 170a peak  ideal for printed circuit board applications  plastic material - ul flammability classification 94v-0 single phase, half wave, 60hz, resistive or inductive load. for capacitive load, derate current by 20%. maximum ratings and electrical characteristics @ t a = 25c unless otherwise specified KBJ10005 - kbj1010 10a glass passivated bridge rectifier  case: molded plastic  terminals: plated leads, solderable per mil-std-202, method 208  polarity: molded on body  mounting: through hole for #6 screw  mounting torque: 5.0 in-lbs maximum  weight: 6.6 grams (approx.)  marking: type number mechanical data kbj6 dim min max a 29.70 30.30 b 19.70 20.30 c 17.00 18.00 d 3.80 4.20 e 7.30 7.70 g 9.80 10.20 h 2.00 2.40 i 0.90 1.10 j 2.30 2.70 k 3.0 x 45 l 4.40 4.80 m 3.40 3.80 n 3.10 3.40 p 2.50 2.90 r 0.60 0.80 s 10.80 11.20 all dimensions in mm _ b c d ee g h j i l m n p r s a characteristic symbol kbj 10005 kbj 1001 kbj 1002 kbj 1004 kbj 1006 kbj 1008 kbj 1010 unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 50 100 200 400 600 800 1000 v rms reverse voltage v r(rms) 35 70 140 280 420 560 700 v average forward rectified output current @ t c = 110c i o 10 a non-repetitive peak forward surge current, 8.3 ms single half-sine-wave superimposed on rated load (jedec method) i fsm 170 a forward voltage per element @ i f = 5.0a v fm 1.05 v peak reverse current @t c = 25c at rated dc blocking voltage @ t c = 125c i r 10 500 a i 2 t rating for fusing (t < 8.3ms) (note 1) i 2 t 120 a 2 s typical junction capacitance per element (note 2) c j 55 pf typical thermal resistance, junction to case (note 3) r jc 1.4 c/w operating and storage temperature range t j ,t stg -65 to +150 c notes: 1. non-repetitive, for t > 1.0ms and < 8.3ms. 2. measured at 1.0 mhz and applied reverse voltage of 4.0v dc. 3. thermal resistance from junction to case per element. unit mounted on 150 x 150 x 1.6mm copper plate heat sink. z ibo seno electronic engineering co., ltd. www.senocn.com KBJ10005 - kbj1010 1 of 2 lead free:: :for rohs / lead free version 


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